工艺能力：电子束曝光，纳米压印，激光直写（无掩膜光刻），真空镀膜，溅射镀膜，PECVD，LPCVD，ICP-RIE，深硅刻蚀，金属刻蚀，介质刻蚀，离子束刻蚀，反应离子束刻蚀，晶圆键合，划片，等等。
常做器件/结构：微针，AR斜齿闪耀光栅，超构透镜（单晶硅，非晶硅，氮化硅），硅光结构，深硅/体硅结构，等等。

Process capabilities: electron beam exposure, nanoimprinting, laser direct writing (maskless lithography), vacuum coating, sputtering Coating, PECVD, LPCVD, ICP-RIE, deep silicon etching, metal etching, dielectric etching, ion beam etching,Reactive ion beam etching, wafer bonding, scribing, and more.
Commonly used devices/structures: microneedles, AR oblique tooth blazed gratings, superlenses (monocrystalline silicon, amorphous silicon, silicon nitride),Silicon optical structure, deep silicon/bulk silicon structure, etc.